中国积体电路产业投融资研究

中国积体电路产业投融资研究基本介绍书名：中国积体电路产业投融资研究
作者：周子学
ISBN：9787121265754
页数：528
出版时间：2015-08
开本：16(170*240)
内容简介积体电路（IC）产业是国民经济和社会发展的战略性、基础性和先导性产业，战略地位显赫。然而，当前我国积体电路产业仍面临晶片製造企业融资难、持续创新能力薄弱、产业发展与市场需求脱节、产业链各环节缺乏协同等突出问题。本书从产业成长、产业生命周期和各阶段投融资需求理论出发，根据中国积体电路产业的发展规律和特点，结合中国积体电路产业投融资现状、模式及存在问题，深入研究了中国积体电路产业的投融资机制。并结合世界各国积体电路产业发展规律和模式，提出了健全和完善中国积体电路产业投融资政策建议。目录信息第一章产业发展投融资理论基础 ···················1第一节资本市场与产业结构升级理论 ·················1一、产业结构调整与升级 ······················ 1二、资本市场促进产业结构升级的作用机制 ·············· 3第二节产业成长规律与投融资分析 ··················7一、产业生命周期与产业发展阶段特徵 ················ 7二、不同类型产业成长规律与投资特徵 ················15三、不同类型产业对融资方式的选择 ·················25第三节产业投融资渠道分析 ···················· 29一、产业融资渠道的类型与特点 ·················· 29二、产业重点融资渠道分析 ···················· 32三、产业链併购整合投资分析 ····················41第四节战略性新兴产业融资特点和路径 ··············· 47一、战略性新兴产业的内涵 ·····················47二、战略性新兴产业的发展阶段和融资特点 ··············48三、我国战略性新兴产业现有的融资路径 ···············51第二章积体电路产业发展现状 ··················· 56第一节积体电路产业的内涵、地位及作用 ·············· 56一、积体电路产业的定义 ····················· 56二、积体电路产业的分类 ······················57三、积体电路行业产业链分析 ····················58四、积体电路产业发展特点与趋势 ··················61五、积体电路在国民经济中的战略地位 ················74第二节我国积体电路产业发展现状和趋势 ·············· 77一、我国积体电路产业发展历程 ···················77二、我国积体电路产业发展现状 ···················83三、我国积体电路产业发展趋势 ·················· 106第三节全球积体电路产业发展现状和趋势 ··············111一、全球积体电路产业发展现状 ·················· 111二、全球积体电路产业发展规律与特点 ··············· 126三、积体电路产业的国际分工与转移 ················ 131四、全球积体电路产业的未来发展趋势················136第四节我国积体电路产业发展面临的机遇和挑战 ···········144一、当前我国积体电路发展形势 ·················· 144二、中国积体电路产业发展中的重要机遇 ·············· 146三、中国积体电路产业发展中的挑战 ················ 148第三章中国积体电路产业投融资现状和机制分析 ···········154第一节我国积体电路产业投融资机遇与障碍 ·············154一、我国积体电路产业投融资发展机遇················154二、我国积体电路产业投融资发展障碍 ··············· 164三、积体电路企业融资障碍和建议——基于企业的调研 ········ 166第二节积体电路产业投融资机制 ··················173一、积体电路产业投资主体 ···················· 173二、积体电路产业融资方式 ···················· 174三、积体电路产业不同发展阶段的融资需求分析 ··········· 181四、我国IC 产业投融资体系概况——以上海市为例 ··········187第三节我国积体电路产业投融资启示与建议 ·············190一、积体电路产业投融资体系的启示 ················ 190二、对政府部门的政策建议 ···················· 193三、对企业的建议 ························ 194第四章中国积体电路产业投融资案例分析 ··············196第一节积体电路企业投融资案例 ··················196一、中芯国际 ·························· 196二、大唐半导体 ························· 198三、长电科技 ·························· 200四、华天科技 ·························· 203五、杭州士兰微 ························· 206 六、同方国芯 ·························· 208七、华微电子 ······················· ···211八、东光微电 ·························· 213九、七星电子 ·························· 215十、其他融资案列 ························ 216第二节 PE/VC 与积体电路产业发展案例 ···············218一、华虹设计：君联资本入驻华虹设计 ··············· 218二、中芯国际 ·························· 219三、炬力积体电路设计（开曼）有限公司 ·············· 220四、谱瑞积体电路（上海）有限公司 ················ 220第三节积体电路企业併购案例 ···················222一、国际併购案例 ························ 223二、国内併购案例 ························ 239第五章产业投资基金的基本理论和运作流程 ·············247第一节产业投资基金的内涵、特点与组织形式 ············247一、产业投资基金的起源与发展 ·················· 247二、产业投资基金的定义和特点 ·················· 259三、产业投资基金的组织形式和比较 ················ 274第二节产业投资基金的运作流程和退出机制 ·············287一、产业投资基金的运作流程 ··················· 287二、产业投资基金的退出机制 ··················· 290第三节产业投资基金运作的国际比较 ················300一、美国 ···························· 301二、日本 ···························· 304三、其他国家 ························· ·306四、国际经验总结 ························ 307五、对我国的借鉴 ························ 308 第六章我国积体电路产业投资基金投资战略研究 ···········310第一节我国积体电路产业国家投资战略概述 ·············310一、重大历史事件回顾 ······················ 310二、国家意志和国家战略 ····················· 311三、国家资金支持 ························ 315四、国家财税政策支持 ······················ 319五、我国积体电路产业政策的经验总结与不足 ············ 320六、我国积体电路产业投资基金设立的原因及意义 ·········· 321第二节我国积体电路产业的国内外差距和赶超战略 ··········324一、我国积体电路设计行业与国际先进水平的差距 ·········· 324二、我国积体电路封测行业与国际先进水平的差距 ·········· 332三、我国积体电路代工製造业与国际先进水平的差距 ········· 336四、我国积体电路装备材料行业与国际先进水平的差距与对策······340第三节我国积体电路产业基金股权介入方式 ·············347一、产业基金的股权投资方式概览 ················· 347二、我国积体电路产业投资基金的股权投资方式或路径 ········ 351第四节我国积体电路产业投资基金的投资範围研究 ··········357一、当前我国积体电路行业投资现状分析 ·············· 357二、我国积体电路企业的未来投资领域和发展方向 ·········· 359三、我国积体电路产业投资基金的投资範围和重点 ·········· 367第七章世界各国积体电路产业发展模式分析 ·············372第一节韩国积体电路产业的发展模式与产业政策 ···········372一、韩国政府促进新兴产业发展的政策措施 ············· 372二、韩国积体电路产业发展初期的制度环境 ············· 375三、韩国促进积体电路产业发展的政策措施与国家战略 ········ 376四、韩国积体电路产业的技术创新路径 ··············· 386五、韩国积体电路企业发展模式：以三星电子为例 ·········· 389 第二节美国积体电路产业的发展模式与政策环境 ·········· 398一、早期美国积体电路产业模式的演进················403三、美国模式对我国的启示 ···················· 405第三节日本积体电路产业的发展模式与政策环境 ···········407一、日本半导体产业发展政策一览 ················· 407二、日本积体电路产业发展历程···················415三、日本积体电路政府支持模式——以超大规模积体电路项目（VLSI）为例425第四节印度积体电路产业的发展模式与政策环境 ···········432一、印度积体电路产业发展政策 ·················· 432二、印度积体电路产业发展现状 ·················· 437三、印度半导体主要套用情况 ··················· 438四、印度半导体产业的激励政策 ·················· 439五、印度IT 产业成功发展的启示 ··················439六、印度IT 产业投融资模式——以班加罗尔软体科技园为例 ······442第五节台湾地区积体电路产业的发展模式与政策环境 ········ 447一、台湾积体电路产业发展历程 ·················· 447二、台湾半导体产业的发展模式 ·················· 452第八章我国积体电路产业配套政策体系研究 ············ 455第一节我国积体电路产业扶持政策现状 ···············455一、两次重大工程 ························ 458二、国家专项资金支持 ······················ 459三、国家财税政策支持 ······················ 461四、金融政策支持 ························ 462五、其他配套政策支持 ······················ 463第二节我国积体电路产业扶持政策的问题与不足 ···········466一、政府办企业办工程 ······················ 467二、国家专项资金存在弊端 ···················· 468三、积体电路产业税收政策存在缺陷 ················ 468 四、资本市场不完善 ······················· 470五、积体电路智慧财产权保护立法存在的问题 ············· 470六、积体电路人才培养存在的问题 ················· 474第三节我国积体电路产业配套政策体系的建立与完善 ·········475一、积体电路产业金融配套政策 ·················· 475二、积体电路产业财税配套政策 ·················· 479三、积体电路产业的创新能力建设 ················· 486四、积体电路产业的人才体系建设 ················· 495参考文献 ···························· 503后记 ······························ 514